A23 is Dual Core Cortex-A7 in TQFP package, it’s like A13 vs A10 – reduced IOs and cut functionality for lower cost.
A23 info leak for the first time this year at IFA expo in Berlin, where Eva Wu the marketing at Allwinner talked about it.
Eva promised me more info to be available after October 10th when Allwinner made media event to talk about their roadmap and as promised the info is already on their web:
A23 is Dual core Cortex-A7 optimized processor which now run up to 1.5Ghz, in TQFP package.
Power consumption is optimized too as when play musing it takes only 50mA, and the reference design they have is with less than 260 external components.
This means A23 will allow lower cost solutions, this of course have it’s cost: they removed the Ethernet and SATA, also display is restricted to 1280×800 pix which clearly targets their market for A23 as designed only for tablets.
What we see also is HIFI build-in audio codec, so portable media players is also possible target market.
- CPU: Cortex™-A7 Dual-Core, 128KB L1 Cache, 256KB L2 Cache
- GPU: Mali400MP2, Supports OpenGL ES 2.0 / VG 1.1 standards
- Video: 1080p@60fps video playback, multi-format FHD video decoding, Mpeg1/2, Mpeg4 SP/ASP GMC, H.263, H.264, WMV9/VC-1, H.264 1080p@60fps, Complies with RTSP, HTTP, HLS, RTMP, MMS, OpenMax protocols
- Display: Supports 1/2/4-lane MIPI DSI up to 1280×800 resolution, MIPI DSI V1.01 and MIPI D-PHY V1.00, RGB/CPU/LVDS LCD up to 1280×800 resolution
- Camera: parallel camera sensor interface, up to 5M CMOS sensor, 8-bit YUV sensor
- Memory: DDR3/DDR3L SDRAM controller, 8-bit NAND Flash controller
- Audio: Integrated Hi-Fi audio codec, Two integrated differential analog mic amplifiers for headset and phone, Talking Standby Mode for ultra-low power consumption during voice calls
- PMU: AXP223 PMIC, 21-channel power output and 2.1A Flash charging, Complies with USB 3.0 power supply standard
- OS: Supports Android 4.2 and above, Android multi-user function
despite the lack of native connectivity like A13, A23 may be still interesting for industrial applications as TQFP packaging is proven to be better for power dissipation and A13 working at 1Ghz do not heats more than few degrees above the ambient temperature, while this can’t be said for A10 BGA package, we expect same for A23 – it will work better in wider temperature ranges