A20-OLinuXino-LIME2 now with PCB revision G


a20-olinuxino-lime2

A20-OLinuXino-LIME2 now is assembling on same PCB Revision G as A20-OLinuXino-LIME2-eMMC.

What are the improvement:

  • Ethernet PHY is changed to RTL8211E replacing the obsolete RTL8211CL no need for kernel patches;
  • we drop the odd shape which was necessary to fit LIME2 in the plastic box as we now have range of metal boxes;
  • the four mount holes now have grounding for better contact with chassis;

Meantime we silently work on further improvement for next revision (to be released March 2017):

  • adding SPI boot Flash;
  • replacing RTL8211E to industrial grade PHY, so the board can be produced completely in -40+85C operating temperature;

 

8 Comments (+add yours?)

  1. xemilo
    Dec 09, 2016 @ 17:46:35

    Congrats. Good job as usual. I hope you put as big SPI flash as possible if it is true that they cost just cents no matter the size.
    I saw a discussion in sunxi land about the High Speed modes.
    If you use a low speed industrial grade eMMC for the future boards, better implement the HS interface on the SD card side.
    But for the laptop if it is not possible to do HS interface for both, then maybe the eMMM should be priority since you don’t need industrial grade part in consumer product. The sunxi community is eager for this HS modes.
    You already know, I just wanted to share my thoughts.
    Happy Holidays and Happy New Year.
    P.S: Do you really test samples at this temperatures (-40+85C) ?

    Reply

  2. David Howard
    Dec 09, 2016 @ 18:32:01

    So for the next rev (industrial), you are able to get a -40..+85C AllWinner A20?
    The whole board will be -40..+85C, or will it be -0..+70C because of A20 but everything else is -40..+85C?

    Reply

  3. LIME-fan
    Dec 10, 2016 @ 10:37:00

    Hooraayyyy! Finally screwholes! 🙂

    Reply

  4. hikerguy1900
    Dec 12, 2016 @ 19:34:31

    I have mixed feelings about the new board footprint. Our custom case design depends on those four notches and allows use to have a case that is nearly the same size as the board without the need for any fasteners. On the other hand it is nice to have a more traditional board footprint with proper mount holes. Hopefully we can upgrade to the A64 before we have to redesign our case for the LIME2.

    Reply

    • adj
      Dec 13, 2016 @ 03:58:31

      I agree. My only complain about olinuxino boards is the lack of form factor consistency (they have 10 form factors for olinuxino, without counting minor differences in mounting holes or connectors). With Lime it seemed the first as a “standard” but we already got two minor incompatibilities: mirroring pin connectors (lime to lime2) and now the mounting holes. I hope they think well the A64 board from the beginning and try to maintain form factor with future boards. For me, pico-itx (100mm x 72mm) form factor and cases with replaceable front panel for the different boards would be ideal.

      Reply

  5. Miha
    Jan 12, 2017 @ 19:01:22

    IMO olimex would easily solve this if it would provide everything as a SODIMM module package and then provide dev boards, for those that need them. Others would build motherboard themselfs

    Reply

    • Ciprian
      Jan 17, 2017 @ 10:43:03

      @Miha: While a SODIMM module would be nice, not everyone wants to build their own motherboard. It would be nice if they had both types of boards, but I guess that would be expensive. I think they stick with the boards that sells the most.

      Reply

  6. Miha
    Jan 21, 2017 @ 00:25:21

    @Ciprian: Well you have to build something yourself usually. So Does it really mater? In case of SODIMM module you can choose what to route And where! Not everybody can design their case so it fits a board. The other pro for module is that you need to design new board if old module is unsupported and you can keep your IO ports where you need them.
    And like I said for those that don’t want to build base boards themselves they could provide one.

    Reply

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