New soldering products in stock: Solder paste and soldering wire

SLD-SAC305C4

We have new product category: Soldering components which include solder paste and soldering wires.

SAC305 solder paste is with the industry standard Sn96.5Ag3Cu0.5 composition. It’s ROHS compliant and has melting temperature 217C. The paste is Class 4 with 20-38um solder particles and is good for printing down to 0.4mm pich components. The packing is 0.5KG, we recommend to use fast shipment when order this paste as it must be kept at low temperature of 5-10C to prevent solder flux separation. The paste is good for 6 months from the date of manufacture.

Some applications are ROHS exempt and still use SnPb solder paste. This paste is with Sn63Pb37 composition and melting temperature 183C. The paste is Class 4 with 25-38um solder particles and is good for printing down to 0.4mm pich components. The packing is 0.5KG, we recommend to use fast shipment when order this paste as it must be kept at low temperature of 5-10C to prevent solder flux separation. You should not use this paste in ROHS compliant products as it contains Lead. The paste is good for 6 months from the date of manufacture.

For manual soldering we offer no clean SAC0307 ROHS compliant soldering wire with 2.2% Flux core and 0.6mm, 0.8mm and 1.0mm diameter. This alloy has melting temperature between 213 and 228C. Soldering iron temperature should be set between 245 and 375C depend on the components size.

For non ROHS compliant manual soldering Sn60Pb40 solder wire with 0.7mm diameter and 2% core Flux is available. This alloy has melting temperature 190C. Soldering iron temperature should be set between 240 and 350C depend on the components size.

 

New Products is stock: Desoldering pumps with teflon tips and copper core de-solder wick

Desoldering Pump 366-А

When you have to repair boards or replace components you need tools to remove the solder from the components.
We now stock two type of desoldering pumps: D-336A black plastic desolder pump from the picture above with plastic body and special anti grip foam coating and

DESOLDERING PUMP GS-136A

metal body GS-136A

Both pumps are easy to use and make good vacuum force to remove the solder. Their pistons are with double air seals which guarantee no air leaks.

SOLDERWICK-2

De-solder wick is another useful tool when removing solder, just put it on the component pin and apply heat with the soldering iron the copper core wick will suck all solder from the component.

It’s with 3mm braid fine wires and 1.5 mm length.

Stencil Printer SD-240 back in stock

SD-240-1

Our popular SD-240 Stencil Solder Mask printers are back in stock. They were out of stock for several months as the producer Technoprint closed their SMT machine production.

Fortunately one of their supplier took over the production and restored it. Now we have SD-240 back in stock and SD-300 will be in stock soon too!

New Products in stock: Preciese Stencil Solder Paste Printer, Stencils for Solder Paste, Raquels for Solder Paste Printing

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We got new section in our web shop: TOOLS

The first member of this section is SD-240 precise frame-less stencil solder paste printer.

SD-240 allow very precise alignment of the PCB and stencil and perfect solder paste deposit. With this printer is possible to print solder paste for down to 0201 components and for BGAs with 0.65 mm step.

We provide paid training option for these who buy this printer, the training is provided in Olimex factory, where we will teach you for one day how to manipulate, storage, and take care for the solder paste, and how to print on PCB with SD-240 for components like A10S 0.65 mm ball pitch BGA ICs for instance.

For these who buy SD-240 we also provide stencil service and will produce high quality stainless steel stencils from gerbers, using the same technology we are using to produce stencils for our own manufacturing process and help with technology know how about stencils and printing.

Stencil printing Raquels with size 10 cm, 15 cm and 18 cm are available.

When thinking for SMT assembly, many think that Pick and Place machine is most important component and usually focus on it. This is right, but the new P&P machines are so precise that they usually never cause problems. Industry study show that about 60% of all defects with SMT PCB manufacturing come from wrong solder paste printing and about 30% of all defects come from wrong Reflow profile and reflow oven setup, so issue caused by P&P are 10% or less.

If you have good solder paste printing and reflow profile even if you place your SMT components by hand you will still have good results.