New useful parts for OLinuXino OSHW Linux computers, soldering tool and new components in stock

USB-RS485-wiring

USB-RS485 is USB to RS485 converter and can be used with any computer with USB including OLinuXino.

A20-OLinuXino-MICRO, A64-OLinuXino, A13-OLinuXino, A33-OLinuXino, iMX233-OLinuXino have Audio input, for these boards we got very compact and flexible PC-MIC-3.5MM

mic

For these who deal with tiny SMT parts we got stackable X*Y smt SMT-BOX-25x32x22 with spring loaded cap:

smd-smt-box

SLD-SPONGE is soldering tip cleaning sponge:

sponge

SLD-STAND is metal stand for soldering irons with place for soldering sponge:

SLD-STAND

CONNECTOR-GX16-4 is robust connector for panel mounting and can connect up to 220V/20A:

GX16-4

WIRE-CLIP-300F is female connector at one end which easy connects to boards with headers and sprint loaded contact at the other end. If you make signal analyzer with FPGA boards these clip wire connectors are very handy to attach to existing boards:

WIRE-CLIP-300F

ALUMINUM-HEATSINK-TO-220 is low cost heatsink for TO-220 devices like voltage regulators and transistors:

ТО220

 

 

New soldering products in stock: Solder paste and soldering wire

SLD-SAC305C4

We have new product category: Soldering components which include solder paste and soldering wires.

SAC305 solder paste is with the industry standard Sn96.5Ag3Cu0.5 composition. It’s ROHS compliant and has melting temperature 217C. The paste is Class 4 with 20-38um solder particles and is good for printing down to 0.4mm pich components. The packing is 0.5KG, we recommend to use fast shipment when order this paste as it must be kept at low temperature of 5-10C to prevent solder flux separation. The paste is good for 6 months from the date of manufacture.

Some applications are ROHS exempt and still use SnPb solder paste. This paste is with Sn63Pb37 composition and melting temperature 183C. The paste is Class 4 with 25-38um solder particles and is good for printing down to 0.4mm pich components. The packing is 0.5KG, we recommend to use fast shipment when order this paste as it must be kept at low temperature of 5-10C to prevent solder flux separation. You should not use this paste in ROHS compliant products as it contains Lead. The paste is good for 6 months from the date of manufacture.

For manual soldering we offer no clean SAC0307 ROHS compliant soldering wire with 2.2% Flux core and 0.6mm, 0.8mm and 1.0mm diameter. This alloy has melting temperature between 213 and 228C. Soldering iron temperature should be set between 245 and 375C depend on the components size.

For non ROHS compliant manual soldering Sn60Pb40 solder wire with 0.7mm diameter and 2% core Flux is available. This alloy has melting temperature 190C. Soldering iron temperature should be set between 240 and 350C depend on the components size.